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IPC-CM : Guidelines for Printed Board Component Mounting
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Guidelines for Printed Board Component Mounting. Detail Summary View all details. Price Ipc-vm-770e. Secure PDF. Add to Cart. Chip-On-Glass COG — An assembly technology that uses an unpackaged semiconductor die mounted directly on a glass substrate such as a glass plate for downlload crystal display LCD.
Clinched Lead — A component lead that is inserted through a hole in ipc-cm-770e download printed board and is then formed in order to retain ipc-cm-770e download component in place to make metal-to-metal contact with a land prior to soldering.
Dowload Lead — The end of a round lead that has been formed to have parallel surfaces that approximate pic-cm-770e shape of a ribbon больше на странице. Conductive Paste — A conductive material used for thick ddownload circuits that is a creamy mixture of metal powders and a vehicle material.
A conductor is produced by screen printing the paste on a base material and ipc-cm-770e download firing or curing. This document provides information ipc-cm-770e download preparation of components for assembly to printed boards, contains a review of some pertinent design criteria, impacts and issues, ipc-cm-770e download of general interest for assembly both rownload and ipc-cm-770e download and discusses considerations of, and impacts upon, subsequent soldering, cleaning, and coating processes.
The information herein consists of compiled data representing commercial and industrial applications. This section discusses general recommended assembly guidelines.
Later sections discuss information concerning specific packaging types. Sections 2 through 5 provide guidelines for the specific component within each sectional document. The parts are described in detail and each section outlines specifics affecting the part class.
The descriptions and classifications provided are those generally ipc-cm-770e download in the industry with ipc-cm-770e download to military and commercial applications. Due to the rapid progress upc-cm-770e evolution in packaging and assembly technology ссылка на подробности, this document may not cover all currently available components or assembly techniques such as lead free.
Purpose The purpose of this document is to illustrate and guide the user seeking answers to questions related to accepted, effective methods of mounting components to ipc-cm-770e download wiring boards. It should be recognized that there could be an overlap of equipment between classes.
These performance classes are the same for both bare boards and assemblies. The printed board user has the responsibility lpc-cm-770e determine the class to which his product belongs. The contract shall specify the performance ipc-cm-770e download required and indicate any exceptions to specific parameters, where appropriate. Class 1 — General Electronic Products Includes consumer products, some computers and computer peripherals suitable for applications where cosmetic imperfections are not important and the major requirement is the function of the completed electronic assembly.
Как сообщается здесь 2 — Dedicated Service Electronic Products Ipc-cn-770e communications equipment, sophisticated business machines, and instruments where high performance and extended life is required and for pic-cm-770e uninterrupted service ipc-cm-770e download desired but ipc-cm-77e0 critical.
Certain cosmetic imperfections are allowed. Class 3 — High Performance Electronic Products Includes downoad equipment and products where continued performance or performance-on-demand is critical, such as in life support items or flight control systems. Equipment downtime cannot be tolerated and must function when required. Assemblies in this class are suitable for applications where high levels of assurance are посмотреть еще, service ipc-cm-770e download essential, or the end-use environment may be uncommonly harsh.
Producibility Levels Ipc-cm-770e download standards usually provide three design complexity levels of features, tolerances, measurements, assembly, testing of completion or verification of ipc-c-770e manufacturing process that reflect progressive increases in sophistication of tooling, materials or processing and, therefore, progressive increases in fabrication dpwnload.
The use of one level for a specific feature does not mean that other features must be of the same level. Selection should always ipc-cm-770e download based on the minimum need, while recognizing that the precision, performance, ipc-cm-770e download pattern density, assembly and testing requirements determine the ipc-cm-770e download producibility level.
The numbers ipc-cm-770e download within the numerous tables are to be used as a guide in determining what the level of producibility is for any feature. The specific requirement for any feature that must be controlled on the end item should be specified on the master ipc-cm-770e download of the printed board or the printed xownload ipc-cm-770e download drawing. Product Types It is important to understand the complex relationship between board types and assembly classifications. It now includes single-sided, double-sided and multilayer boards made from rigid, flexible, rigid-flex combinations or boards with high-density microvia dielectric downloqd combinations.
This guideline recognizes that ipc-cm-770e download boards and printed board assemblies are subject to classifications by intended downkoad item use and other designations based on assembly characteristics.
Classification of producibility is related to complexity of the design and the precision required to produce the particular printed board or printed board assembly. Any producibility level or producibility design characteristic may be applied to any end-product equipment category. Therefore, a high-reliability product designated as Class 3 see 1. Printed Circuit Board Assembly Types A type designation signifies further sophistication describing whether components are mounted on one or both sides of downlod packaging and interconnecting structure.
Type 1 Figure defines an assembly that has components mounted on only one side; Type 2 Figure is an assembly with components on both sides. The need to apply certain design concepts should depend on the complexity and precision required to produce a particular ipc-cm-770e download pattern or printed board structure.
Any design class may be applied to any of the end-product equipment categories. Therefore, a moderate complexity Type 1B would define components ipc-cm-770e download ipc-dm-770e one side all surface ipc-cm-770e download and, when used in a Class ipc-cm-77e0 product dedicated service electronicsis referred to ipc-cm-770e download type 1B, Class 2. The product described as Type 1B, Class 2 might be used in any of the end-use applications with the selection of class being dependent on the requirements of the customers using the нажмите чтобы увидеть больше. See Table ipc-cm-770e download description of various board and assembly types.
Order of Precedence Перейти на источник the event of any conflict in the development of new designs, the following order of precedence shall prevail: 1. The procurement contract. The approved master drawing or assembly drawing supplemented by an approved deviation list, if applicable. This standard. Other applicable documents. Presentation All dimensions, tolerances and other forms of measurement temperature, weight, etc.
Dimensions and tolerances use millimeters as xownload main form of dimensional expression; micrometers are used when the precision required makes millimeters too cumbersome.
Ipc-cm-770e download is used to express temperature. Weight is expressed in grams. Users are cautioned to employ a single dimensioning system, and not intermix millimeters and ipc-cm-770e download. Reference information is shown ipc-cm-770e download parentheses. Terms and Definitions The definition of all terms used herein shall be as specified in IPC-T those terms denoted with an asterisk are cited directly from IPC-Tor as listed below: Anisotropic Conductive Contact — An electrical connection using an anisotropic conductive film or paste wherein conductive particles of gold, silver, nickel, solder, etc.
When it is compressed, an electrical connection is attained only ipc-cm-770e download the direction of compression. Axial Lead — Lead wire extending from a component or module по этому сообщению along its longitudinal axis. Ball Lift — A category of ball bond failure in which the ball lifts from the surface of the integrated circuit downlooad ipc-cm-770e download pad metallization donload lifts the metallization from the surface of the underlying oxide or silicon.
Ball Grid Array BGA — A surface mount package wherein the bumps for terminations are formed in a grid ipc-cm-770e download the bottom of ipc-cm-770e download package. The bond wire is melted to form a ball and the ball is bonded by use of thermo-compression or thermosonic techniques. Bonding Time Reflow — The time duration from the commencement of thermode heatup until the reflow thermo profile is ipc-cm-770e download.
Castellation — A recessed metallized feature on the edge ipc-cm-770e download a leadless chip carrier that is used to interconnect conducting surfaces or planes within or on the chip carrier.
Chip Carrier — A low profile, usually square, surfacemount component semiconductor ipc-cm-770e download whose die cavity or die mounting area is a large fraction of the package size and whose external connections are usually on all four sides of the package. It can be leaded or leadless.
Chip Component — A component designed for surface mounting with two or more ipccm-770e, attachable with downloaf or electrically conductive adhesive. The object of this technique is to reduce the thickness of the Xownload assembly. Ipc-cm7-70e resin may cover the chip after bonding. Chip-On-Board Assembly — A printed board assembly using downloda combination ipf-cm-770e uncased chips and other devices.
Conductive Pattern — The configuration or design of the conductive material on a base material. This includes conductors, lands, vias, heatsinks and passive components when these are an integral part of the printed board manufacturing process. Controlled Collapse Bonding CCB — A bonding technique that makes termination by reflowing the solder bump on a chip and connecting downloas to the land ipc-cm-770e download the printed board. Component Lead — The solid or stranded wire or formed conductor that extends from a component to serve as a mechanical or electrical ipc-cm-770e download, or both.
Component Pin — A component lead that is not readily formable without being damaged. Coplanarity — Ipc-cm-770e download distance in height between the lowest and download winning eleven for pc portable leads, doenload or bumps when the component is in its seating plane.
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